YAP+: Pad-Layout-Aware Yield Modeling and Simulation for Hybrid Bonding
Published in IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2026
YAP+ extends hybrid-bonding yield analysis with critical, redundant, and dummy pads across arbitrary two-dimensional physical layout patterns.
Recommended citation: Zhichao Chen and Puneet Gupta. (2026). "YAP+: Pad-Layout-Aware Yield Modeling and Simulation for Hybrid Bonding." IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.
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