YAP: Yield Modeling and Simulation for Advanced Packaging
Published in 2025 62nd ACM/IEEE Design Automation Conference (DAC), 2025
YAP models the key failure mechanisms that contribute to yield loss in Cu–Cu hybrid bonding and provides more than 10,000× faster runtime than simulation while maintaining virtually identical accuracy.
Recommended citation: Zhichao Chen and Puneet Gupta. (2025). "YAP: Yield Modeling and Simulation for Advanced Packaging." 2025 62nd ACM/IEEE Design Automation Conference (DAC), pp. 1–7.
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